New contract advances CAES Gaisler product portfolio to include a 16-core RISC-V platform that will enable the next generation of space-grade fault- and radiation-tolerant microprocessors.

GOTHENBURG, Sweden, DECEMBER 22, 2021 (CAES PR) – CAES, a leader in advanced mission-critical electronics, has been awarded a contract with the European Space Agency (ESA) to develop a fault- and radiation-tolerant system-on-chip. Funded by the Swedish National Space Agency, the project will improve performance and power efficiency in satellite and spacecraft applications by developing a 16-core, space-hardened microprocessor based on the open RISC-V instruction set architecture (ISA).

ARLINGTON, Va. and LAUSANNE, Switzerland — CAES, the leading provider of RF technologies and related mission critical electronic solutions, and SWISSto12, the leading provider of 3D printed technology for RF applications in the aerospace and defense industry, announced today a strategic alliance to enable CAES to bring additive manufacturing and 3D printing technology to US customers. The alliance grants CAES exclusive license to SWISSto12’s patents, trade secrets, and product designs for the US market. CAES and SWISSto12 will work together with US customers on new designs to meet the high performance requirements of future missions.