- Parabolic Arc
- March 30, 2023
NASA Awards Research, Engineering, Mission Integration Services Contract
WASHINGTON, DC (NASA PR) — NASA has selected 16 companies to provide a diverse range of competitive task-order contracts for serving the research and engineering products and services needs of the International Space Station.
Research, Engineering, and Mission Integration Services (REMIS) is a multi-award contract with indefinite-delivery/indefinite-quantity, firm-fixed price and cost-plus-fixed-fee line item numbers. The contract begins Sept. 6 with a five-year base period, followed by a two-year option that may be exercised at NASA’s discretion. The maximum potential value of the contract, including the option, is $500 million.
The selected companies are:
- Craig Technical Consulting of Cape Canaveral, Florida
- ZIN Technologies of Cleveland
- Techshot of Greenville, Indiana
- BioServe Space Technologies of Boulder, Colorado
- Teledyne Brown Engineering of Huntsville, Alabama
- Oceaneering International of Houston
- Wyle Laboratories of Houston
- Consolidated Safety Services Incorporated of Fairfax, Virginia
- Leidos Innovations Corporation of Houston
- Barrios Technology of Houston
- Sierra Nevada Corporation/Orbital Technologies Corporation of Madison, Wisconsin
- Hamilton Sundstrand Space Systems International of Houston
- MEI Technologies of Houston
- Stinger Ghaffarian Technologies of Greenbelt, Maryland
- Tec-Masters of Huntsville, Alabama
- The Boeing Company of Houston
The statement of work includes the ability to solicit spaceflight and ground hardware and software, sustaining engineering functions, engineering services, payload facility integration, and research mission integration and operations services on a commercial basis, with minimal involvement of the government.
The contract was developed for use by NASA’s International Space Station Program, but may be utilized by other NASA organizations or federal government agencies through a mutual agreement with the International Space Station Program.
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